Epoxy Based, Solvent-Free, Lamination Resin - EPOX LM 225

Epoxy Based, Solvent-Free, Lamination Resin - EPOX LM 225


EPOX LM 225 is epoxy based, two component, solvent-free, lamination resin. It can be used to filling capillary gap of concrete floors and increases strength.

Fields of Application

Features and Benefits

Application Procedure

Preparation of Substrate

Application surface must be dry, clean and clean off materials which prevent bonding, such as dust, oil, rust and loose pieces. Weak parts of the surfaces should be removed by milling, sandblasting or sanding. If application surface is too bright surface, it should be roughened with milling or sandblasting.

Application Method

Component A and B is stirred separately under low speed mixer, then Component B is slowly poured into Component A under the low speed mixer and continue mixing until obtaining a homogenous mixture without any agglomerate (approximately 3-4 minutes).

The mixture must be consumed within 60 minutes. Mixture is applied by trowel or roller depends on application area. After the fiberglass is laid on the wet resin, the lamination roll is moved over the glass fiber. If there are areas that are unsaturated with the resin, the resin is applied again. After drying, the other stages of the coating are started.


Depends on usage area.


A component: 17 kg + B component: 8 kg = 25 kg set

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